简介： 道尔DU902是一种单组分环氧密封剂，用于CSP或BGA底部填充制程。它能形成一致和无缺陷的底部填充层，能有效降低由于硅芯片与基板之间的总体温度膨胀特性不匹配或外力造成的冲击。受热时能快速固化。较低的粘度特性使得其能更好的进行底部填充；较高的流动性加强了其返修的可操作性。DU902 is a one component, epoxy encapsulant designed for use as a repairable underfill resin for CSP or BGA. It provides a uniform and void free underfill layer, which gives excellent protection of printed circuit boards from soldering failure due to impact and thermal cycling. It cures rapidly on exposure to heat. The low viscosity allows filling in gap under CSP or BGA. Its high flexibility provides enhanced repairability.