简介： DE206是环氧树脂（快速热硬化作用）粘合剂，由于它的粘度特性和摇变性，特别适用于钢网印胶制程，并能获得良好成形而有效预防PCB板的溢胶现象。它按无公害产品的要求,开发成要求高温耐热性的无铅(Pb-Free)焊接上适用的产品。Dover DE206 is a thermosetting single component epoxy. It is one of special glue especially designed for surface mount device. Particularly suited where very fast cure is required on high speed SMT lines. According to the demand of which social effects of pollution it is designed for use in Pb-Free soldering which require high temperature .