简介：本产品为单组份，低温热固化改良型环氧树脂胶粘剂。该产品用于低温固化，并能在极短的时间内在各种材料之间形成最佳粘接力。产品工作性能优良，具有较高的保管稳定性，适用于记忆卡、CCD/CMOS 等装置。特别适用于需要低温固化的热敏感元件。 DE240 is a one part, low temperature heat curable epoxy. This product is designed to cure at low temperature and gives excellent adhesion on a wide range of materials in considerably short time. Typical applications include Memory cards 、CCD/CMOS Assemblies. Particularly suited where low curing temperature is required for heat sensitive components.