Chip-level underfill material, sealant, electronic glue

Innovative Materials Development

 

Epoxy

Epoxy Adhesive A high-performance adhesive material widely used in automotive, aerospace, electronics, and other industrial applications. Because of its mechanical strength, bonding strength, chemical stability, electrical insulation, dimensional stability, weather resistance and other advantages and favored.

The newbonder has been carefully cultivated in the field of epoxy resin adhesives for 20 years, and has complete "demand → development → trial production → mass production" capabilities and rich experience in directional development. In the reinforcement, toughening, curing conditions optimization, green environmental protection optimization and other material properties, as well as colloidal color adjustment, rheological properties adjustment and other application properties have a lot of successful experience.

Acrylic acid

Acrylic adhesive (acrylic acid) is a kind of adhesive with acrylate or methacrylate as the main component. Acrylic adhesive has the advantages of fast curing and high transparency, and is widely used in electronics and optics.
newbonder has a rich acrylic adhesive product line, involving electronics, optics, medical, automotive and other fields. He has mature experience in optical modification, mechanical modification, rheological properties optimization, water resistance, thermal conductivity, and electrical conductivity modification.

Hybrid system

Hybrid curing system (hybrid curing system) refers to an adhesive with two or more curing methods, and is widely used in application scenarios where curing conditions are limited, such as camera aa process and display panel pre-packaging process. The hybrid curing system has significant advantages in improving curing efficiency, avoiding curing damage, and optimizing process flow.
The newbonder has a mature "UV moisture", "UV thermal curing" curing scheme, can be used flexibly according to different application scenarios.