Encapsulated protective material

Encapsulation protection materials have broad applications in many fields, such as integrated circuit packaging and smt. The main function of these materials is to protect the device from the external environment, have good mechanical strength, moisture resistance, heat resistance and electrical insulation performance, and ensure the stability and reliability of its performance.

Filler material forms include, but are not limited to, the following types:
• edgebond
• conformal coating
• glob-top
• side sealing