Filling material
The filling material is an integral part of the packaging process and plays an important role in protecting the core and improving reliability and performance. The main function is to protect the device body from the external environment (water vapor, temperature, pollution, etc.), and to achieve heat conduction, insulation, moisture resistance, pressure resistance, supporting and other composite functions.
Filler material forms include, but are not limited to, the following types:
• underfill
• gap filling
Board-level underfill material
Product Series
|
resin system
|
Curing mode
|
Typical characteristics of products
|
ae5987 series
|
epoxy
|
heat curing
|
High reliability, good curing compatibility
|
ae5983 series
|
epoxy
|
heat curing
|
Low Modulus, Bending Resistant
|
ae5981 series
|
epoxy
|
heat curing
|
Low temperature curing
|
ae5980 series
|
epoxy
|
heat curing
|
High reliability, high liquidity
|
ae5202 series
|
epoxy
|
heat curing
|
High reliability, good filling effect
|
ae63x series
|
epoxy
|
heat curing
|
Bending resistance, can be matched with one-section top encapsulation process
|
chip-level underfill material
Product Series
|
resin system
|
Curing mode
|
Typical characteristics of products
|
ic73x series
|
epoxy
|
heat curing
|
High reliability, good filling effect
|
ae5980 series
|
epoxy
|
heat curing
|
High reliability, high liquidity
|