Conductive silver adhesive, conductive thermal material, sealing edge assembly

Filling material

The filling material is an integral part of the packaging process and plays an important role in protecting the core and improving reliability and performance. The main function is to protect the device body from the external environment (water vapor, temperature, pollution, etc.), and to achieve heat conduction, insulation, moisture resistance, pressure resistance, supporting and other composite functions.

Filler material forms include, but are not limited to, the following types:
underfill
gap filling

Board-level underfill material

Product Series resin system Curing mode Typical characteristics of products
ae5987 series epoxy heat curing High reliability, good curing compatibility
ae5983 series epoxy heat curing Low Modulus, Bending Resistant
ae5981 series epoxy heat curing Low temperature curing
ae5980 series epoxy heat curing High reliability, high liquidity
ae5202 series epoxy heat curing High reliability, good filling effect
ae63x series epoxy heat curing Bending resistance, can be matched with one-section top encapsulation process
Adhesive glue, electronic glue, structural assembly materials

chip-level underfill material

Product Series resin system Curing mode Typical characteristics of products
ic73x series epoxy heat curing High reliability, good filling effect
ae5980 series epoxy heat curing High reliability, high liquidity
Conductive and Thermally Conductive Materials, Conductive Silver Adhesive, Encapsulation and Protection Materials