What factors affect the thermal conductivity of thermal conductive silica gel sheet

The main substrate of thermal conductive silicone film is silicone gel, which is a thermal conductive medium material synthesized through special processes by adding various auxiliary materials such as metal oxides. The following is a specific introduction to the factors that affect the thermal conductivity of thermal conductive silicone film
1. Types and characteristics of polymer matrix materials: The higher the thermal conductivity of the matrix material, the better the basic dispersibility of the filler, and the better the degree of bonding between them. Therefore, the thermal conductivity of the thermal conductive silicone film will be better
2. Types of fillers: The higher the thermal conductivity of the filler, the more it will directly affect the thermal conductivity of the silicone film
3. Content of filler: The distribution of filler polymer determines the thermal conductivity of thermal conductive silicone film. When the content of filler is small, the thermal conductivity effect is not significant; When the direction of the thermal network chain is consistent with the direction of heat flow, the thermal conductivity is the best. Therefore, there exists a critical value for the amount of thermal conductive filler.
4. Shape of filler: The pathway that easily forms a thermal conductivity sequence is whisker fiber sheet particle. The easier the filler forms a thermal conductivity pathway, the better the thermal conductivity performance will be.
5. Bonding characteristics between filler and substrate material interface: The higher the degree of bonding between filler and substrate, the better the thermal conductivity. Choosing a suitable coupling agent for surface treatment of filler can increase the thermal conductivity by 10% to 20%