Semiconductor Industry
Semiconductor packaging is an important part of the semiconductor industry chain. With the rapid development of emerging technologies such as AI, 5G, and IoT, the demand for semiconductor chips continues to increase, which promotes the development of the packaging industry. As the core process continues to shrink, advanced packaging technology will become the focus of future development, such as flip chip, wafer-level packaging, system-level packaging, etc. At the same time, the semiconductor envelope industry will be more cross-border integration with other sectors. For example, the cooperation with automobile, consumer electricity, data and other fields will be closer, and the application scenario will be more extensive.
Through the NEWBONDER with the domestic head seal in the technical layer of the broad cooperation, the traditional packaging, advanced packaging structure assembly materials, packaging protection materials, such as directional development, to achieve domestic substitution.
Advanced Packaging Materials
Mainly used in packaging forms including wafer level packaging, inverted ball grid array packaging, inverted chip level packaging, system level packaging, etc. In terms of craftsmanship, it includes types such as bottom filling and cofferdam filling.
Traditional Packaging Materials
Mainly used in the packaging field of discrete devices, including lead frame chip packaging, substrate chip packaging, and shell and tube chip packaging. Process applications include chip encapsulation, potting, reinforcement, bottom filling, and other types.
